Journal of Micromechanics and Microengineering期刊2024年亮点文章

亮点文章

Aaron J Yeiser et al 2024 J. Micromech. Microeng. 34 085010

Highly sensitive flexible capacitive pressure sensor with structured elastomeric dielectric layers

Gaurav Rawal and Animangsu Ghatak 2024 J. Micromech. Microeng. 34 025012

Fabrication of a piezoelectric micromachined ultrasonic transducer (PMUT) with dual heterogeneous piezoelectric thin film stacking

Xuanmeng Qi et al 2024 J. Micromech. Microeng. 34 035005

3.8 × 3.8 mm² compact piezoelectric resonant MEMS scanner using fork-shaped and ring-shaped actuators

Yuki Okamoto et al 2024 J. Micromech. Microeng. 34 105003

MEMS audio speakers

Meera Garud and Rudra Pratap 2024 J. Micromech. Microeng. 34 013001

A combined MEMS thermal vacuum sensor with a wide pressure range

Chuang Yuan et al 2024 J. Micromech. Microeng. 34 015006

Damping of 3D-printed polymer microbeam resonators

Jikke de Winter et al 2024 J. Micromech. Microeng. 34 015004

Design and fabrication of microfluidic devices: a cost-effective approach for high throughput production

Tony Thomas and Amit Agrawal 2024 J. Micromech. Microeng. 34 015008

Dynamic micromechanical measurement of the flexural modulus of micrometre-sized diameter single natural fibres using a vibrating microcantilever technique

Ali Reda et al 2024 J. Micromech. Microeng. 34 015009

A vision sensor for simultaneous imaging and distance sensing in real-time

Keewoong Haan et al 2024 J. Micromech. Microeng. 34 015003

Experimental study on femtosecond laser ablation of 4H–SiC substrate

Ziqiang Zhao et al 2024 J. Micromech. Microeng. 34 025005

Carbon dioxide reduction utilizing a bismuth halide perovskite as immobilized photocatalyst in a 3D printed microreactor

Jose A Santamaria Cordero et al 2024 J. Micromech. Microeng. 34 025002

Demonstration of MHz piezoelectric micromachined ultrasonic transducers array and its potential application for biomedical treatment

Dengke Wang et al 2024 J. Micromech. Microeng.34 035007

Effect of bonding adhesive thickness on temperature characteristics and strain characteristics of SAW strain sensors

Qiang Liu et al 2024 J. Micromech. Microeng. 34 035006

Computational modelling and experimental investigation of micro-electrochemical discharge machining by controlling the electrolyte temperature

Dil Bahar et al 2024 J. Micromech. Microeng. 34 035001

Wafer-scale silicon microfabrication technology toward realization of low-cost sub-THz waveguide devices

Xinghai Zhao et al 2024 J. Micromech. Microeng.34 045003

Inverse design of electromagnetic metamaterials: from iterative to deep learning-based methods

Chen Ma et al 2024 J. Micromech. Microeng. 34 053001

Graphene resonant pressure sensor with ultrahigh responsivity-range product

Swapnil More and Akshay Naik 2024 J. Micromech. Microeng. 34 075006

From microchips to microneedles: semiconductor shear testers as a universal solution for transverse load analysis of microneedle mechanical performance

Kazim Haider et al 2024 J. Micromech. Microeng. 34 095006

Aspect ratio optimization of piezoelectric extensional mode resonators for quality factor and phase noise performance enhancement

Ken-Wei Tang et al 2024 J. Micromech. Microeng. 34 115003

• 2023年影响因子：2.4  Citescore：4.5
• Journal of Micromechanics and Microengineering（JMM）是该领域的领军期刊，涵盖了微型机电结构、设备和系统，以及微观力学与微机电的各个方面。JMM专注于制造和集成技术方面的原创性研究，推广新的制造技术及设备。该期刊的研究范围包括微型工程和纳米工程学，涉及物理、化学、电子和生物等领域，也发表关于硅和非硅材料的制造和集成方面的最新研究。