STMP特刊征稿|Defects Inspection

09 10月 2024 gabriels

特刊详情

客座编辑

  • 刘俭,哈尔滨工业大学
  • 丁旭旻,哈尔滨工业大学
  • 刘辰光,哈尔滨工业大学

 

主题范围

Surface and subsurface defects detection refers to the process of identifying and locating any imperfections, abnormalities, or discontinuities on the surface or within the subsurface layers of a material or object. Particularly in semiconductor manufacturing, it is crucial to ensure the quality and reliability of the fabricated devices. Subsurface defects, such as microcracks, voids, or delaminations, can be more challenging to detect compared to surface defects, since these defects may not be visible under optical microscopy. Advanced imaging, characterization, and analysis techniques, as well as the integration of multiple inspection methods to improve defect detection capabilities are urgently required.

This special issue aims to present advanced imaging techniques for defect detection with improved resolution, sensitivity, and characterization capabilities in various materials and industries, including semiconductor manufacturing. This special issue will include the following topics:

  • Electron Beam Techniques: Scanning Electron Microscopy (SEM) and Transmission Electron Microscopy (TEM)
  • Optical Microscopy: High-resolution Confocal Microscopy, X-ray radiography and X-ray computed tomography (CT), Near-field Scanning Optical Microscopy (NSOM), and Flat optics/metasurface for advanced imaging
  • Spectroscopic imaging and Raman Spectroscopy
  • Mass spectrometry imaging and Infrared Thermography
  • Electrical characterization and analysis, Atomic Force Microscopy (AFM) and Acoustic Microscopy
  • AI algorithms for defect detection and classification

 

投稿流程

特刊文章与STMP期刊常规文章遵循相同的审稿流程和内容标准,并采用同样的投稿模式。

有关准备文章及投稿的详细信息,可以参阅IOPscience页面的作者指南。

作者可登入期刊主页进行在线投稿,在“文章类型”中选择“特刊文章”,并在“选择特刊”的下拉框中选择“Defects Inspection:Advanced Imaging for Surface and Subsurface Measurement”。

投稿截止日期:2024年12月31日。


期刊介绍

Surface Topography: Metrology and Properties

  • 2023年影响因子:2.0  Citescore:4.1
  • Surface Topography: Metrology and Properties(STMP)专注物理、化学、材料科学及工程研究中关于表面的最新应用和功能,是一本于2013年创刊的纯电子期刊。该刊旨在为来自不同领域的学者、工业界人士和工程师提供一个国际化平台,发表他们的研究成果、最新研究和研究案例。